Search
备案
Page Copyright© HIWIN TECHNOLOGIES(CHINA) CORP.
No. 2, Xiazhuang Road, Industrial Park, Suzhou, Jiangsu, China
手机产品分类0516
Wafer Aligner
basic information
Detailed parameters
Categories:
Multi Axis Robot
heat:
number:
-
+
Download
features
● HPA series is a three-axis controlled wafer edge finder. The whole series adopts HIWIN micro single axis robot module to realize the advantages of high speed, high precision, high rigidity, high efficiency and small volume.
● all in one design, without additional controller and wiring space, the product volume is the smallest in the industry under the condition of equal specifications.
● equipped with intelligent light transparent laser sensor, it can support the contour detection function of transparent, translucent and opaque objects, and is applicable to the wafer and glass with a diameter of 100mm~300mm.
● the cleanliness grade of the product is ISO class 3 (Class 1), and the application range includes semiconductor, optoelectronics and other industries.
application
It is applicable to the calibration and alignment of semiconductor industry (wafer), LED industry (sapphire substrate), photoelectric industry (glass), etc.
keywords:
On a
RWSE Wafer Robot
The next article
RT605-909-GB Articulated Robot