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No. 2, Xiazhuang Road, Industrial Park, Suzhou, Jiangsu, China

手机产品分类0516

RWD Wafer Robot

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特征软硬件垂直整合优势，并且采用高精密，高刚性直驱马达，重复精度达±0.02mm，回转半径小，空间使用率高。 应用适用于半导体产业(晶圆取放)、光电产业(小型面板、小型太阳能板)、LED产业(蓝宝石基板、胶环)等取放设备。
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Multi Axis Robot
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产品描述

Features

The advantages of vertical integration of hardware and software, and the use of high-precision, high-rigidity direct drive motor, repeatability of ± 0.1mm, small radius of gyration, high space utilization.

 

Application example

Applicable to the semiconductor industry (wafer pick and place), optoelectronic industry (small panel, small solar panels), LED industry (sapphire substrate, rubber ring) and other pick and place equipment.

 

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